LI Kai fu,GAO Zhen zhong,SUN Jin. Study of Particleboard Wet Stress[J]. Journal of South China Agricultural University, 2001, 22(3): 83-85,89. DOI: 10.7671/j.issn.1001-411X.2001.03.026
Citation:
LI Kai fu,GAO Zhen zhong,SUN Jin. Study of Particleboard Wet Stress[J]. Journal of South China Agricultural University, 2001, 22(3): 83-85,89. DOI: 10.7671/j.issn.1001-411X.2001.03.026
LI Kai fu,GAO Zhen zhong,SUN Jin. Study of Particleboard Wet Stress[J]. Journal of South China Agricultural University, 2001, 22(3): 83-85,89. DOI: 10.7671/j.issn.1001-411X.2001.03.026
Citation:
LI Kai fu,GAO Zhen zhong,SUN Jin. Study of Particleboard Wet Stress[J]. Journal of South China Agricultural University, 2001, 22(3): 83-85,89. DOI: 10.7671/j.issn.1001-411X.2001.03.026
Particleboard gives rise to wet stress in the course of manufacture and use owing to the change of moisture content. The result shows that the wet stress caused by wet effect is about 0.21 MPa, accounting for 13.4% of the average interface combination intensity reduction value. Qualitative and quantitative appraisal of wet stress is critically important to enhance the combination stability at interface.
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