LI Kai-fu. Study on Interface Combination Intensity of Particleboard[J]. Journal of South China Agricultural University, 2002, 23(4): 81-83. DOI: 10.7671/j.issn.1001-411X.2002.04.024
Citation:
LI Kai-fu. Study on Interface Combination Intensity of Particleboard[J]. Journal of South China Agricultural University, 2002, 23(4): 81-83. DOI: 10.7671/j.issn.1001-411X.2002.04.024
LI Kai-fu. Study on Interface Combination Intensity of Particleboard[J]. Journal of South China Agricultural University, 2002, 23(4): 81-83. DOI: 10.7671/j.issn.1001-411X.2002.04.024
Citation:
LI Kai-fu. Study on Interface Combination Intensity of Particleboard[J]. Journal of South China Agricultural University, 2002, 23(4): 81-83. DOI: 10.7671/j.issn.1001-411X.2002.04.024
Study on Interface Combination Intensity of Particleboard
A microcosmic mechanics model was established and used to describe interface combination status of particle board. Shearing stress and direct stress were separated by limited unit law analysis. It's demonstrated that the interface destruction was due to shearing stress and that the end of glue layer interface of pulled particle was the weak point of combination.
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